The initial structure can be realised by lithography or any other structuring technique (e.g. o imprint, hot embossing or injection moulding). This method allows the fabrication of ometer sized gaps andpletely eliminates the need for a lift-off process. Different substrate materials like silicon, Pyrex® or polymers can be used.ples electronic structure methods to show that the piezoresistive strain gauge factor of single-crystalline bulk n-type silicon-germanium alloys at carefully controlledposition can reach values of G=500, three times larger than that of silicon, the most sensitive such material used in industry today. At cryogenic temperatures of 4 K we find …The PMNP Laboratory (Yan research group) is interested in high-accuracy, high-efficiency, resource-saving manufacturing technologies. Through micro/ometer-scale material removal, deformation, and surface property control, new products with high added value are provided to micromechanical, optical, optoelectronic, and biomechanical applications.Feb 24, 2017 · The torque values determined by the CNT sensor corresponding to low (1–1.20 Nm) and high torque (2.70–2.50 Nm) values, measured by isokinetic dynamometer, were chosen. Figure 8 shows the mean values and standard deviations of low (low-resp) and high (high-resp) torque values used in thisparison.